Product Overview

For more than three decades GET Engineering  has provided ruggedized products and solutions to the DoD and their prime contractors. Our continued commitment to providing our customers with Lifetime Software and Hardware Support, Custom Solutions that are reliable and cost-effective has made us the leader in our industry. To facilitate this, GET Engineering  provides a complete in-house engineering and manufacturing team enabling custom rapid solutions.

Continuing in this tradition, GET Engineering is please to introduce a High Density Input Output (HDIO) Product Family.  This product comprises of a HDIO  XMC Carrier Cards capable of interfacing three HDIO  Modules.  The HDIO  XMC Carrier Card and Modules fully complies with VITA 42.0 and 48.2 specifications. GET Engineering offers a front or a rear HDIO  XMC Carrier Card with up to 60 I/O pins. 

Designed for reliability in a rugged and harsh environments, the HDIO System uses screws to reliably connect the HDIO  module to the conduction cooled HDIO  carrier card and thermal bars to conduct heat from the HDIO modules to the HDIO  carrier card.   The HDIO  XMC Carrier Card can be conformally coated with Acrylic, Polyurethane or Parylene for increased reliability against environment.

Key Hardware Features

• Military and  Industrial Grade

• Fully Complaint XMC 42.0 VITA Specification

• Conduction Cooled VITA 48.2

• Rear or Front I/O

• Up to 60 IO Pins

• Attaches up to three HDIO  Modules

• PCI Express version 2.1 compliant

Key Software Features

• Support Windows or Linux OS