GET Engineering HDIO Digital to Analog Converter (DAC) 2020 Module has 16 channel, 16 bit DAC. This module features two Linear Technology LTC 2666-16 DAC chips with an integrated precision reference with typical 2ppm/°C stability. The DACs have built-in rail-to-rail output buffers. The DAC output ranged can be software configured for a wide range of voltages. The ranges of each channel is independently programmable. A Xilinx® Artix FPGA controls both DACs.
Designed for reliability in a rugged and harsh environments, the HDIO System uses screws to firmly attach the HDIO module to the conduction cooled HDIO carrier card and thermal bars to conduct heat from the HDIO modules to the HDIO carrier card. The HDIO module can be conformally coated for increased reliability against humidity.
GET Engineering provides the user with the HDIO DAC 2020 Module Application Interface (API) and GET console. The GET console is a program that provides the user with a Graphic User Interface (GUI) that discoveries the module and the user can set the output voltage range, output fixed voltages or create a waveform to any of the channels allowing the engineer to quickly start using the HDIO family of products.
Key Hardware Features
Military and Industrial Grade
16 DAC Channels
16 bit DAC
Size ~21 mm x 64 mm
Precision Reference 2ppm/°C typical
Outputs Drive ±10mA
Key Software Features
Independently Programmable Output Ranges:
0V to 5V, 0V to 10V, ±2.5V, ±5V, ±10V
Support Windows or Linux OS
Size: ~ 21 x 64 mm
Weight: 0.014 lbs
Configuration: 16 Channels, Single Ended
Resolution: 16 Bits
0 V to +5 V
0 V to +10 V
+/- 2.5 V
+/- 5 V
+/- 10 V
Settling time: 9-20 msec
Throughput Rate: 4 usec / 16 channels
PCI Express Version 2.1
Operating Temperature -40° to 85° C
Storage Temperature -55° to 125° C
Humidity Design to Meet MIL STD 810G
Shock Design to Meet MIL STD 810G
Vibration Design to Meet MIL STD 810G
Information on this data sheet is subject to change without notice.