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Product 10202001

HDIO

Digital to Analog Converter

32 Channel, 16 Bit

 
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Product Overview

GET Engineering HDIO Digital to Analog Converter (DAC) 2020 Module  has 32  channel, 16 bit DAC.  This module features fourLinear Technology LTC 2666-16 DAC chips with an integrated precision reference with typical 2ppm/°C stability.  The DACs have built-in rail-to-rail output buffers. The DAC output ranged can be software configured for a wide range of voltages. The ranges of each channel is independently programmable.  A Xilinx® Artix FPGA controls both DACs.

 Designed for reliability in a rugged and harsh environments, the HDIO System uses screws to firmly attach the HDIO module to the conduction cooled HDIO carrier card and thermal bars to conduct heat from the HDIO modules to the HDIO  carrier card.   The HDIO module can be conformally coated for increased reliability against humidity.

GET Engineering  provides the user with the HDIO DAC 2020 Module Application Interface (API) and GET console.  The GET console is a program that provides the user with a Graphic User Interface (GUI) that discoveries the module and the user can set the output voltage range, output fixed voltages or create a waveform to any of the  channels allowing the engineer to quickly start using the HDIO  family of products.

 

Key Hardware Features

  • Military and  Industrial Grade

  • 32 DAC Channels

  • 16 bit DAC

  • Size ~21 mm  x 64 mm

  • Single Ended

  • Built-In-Test

  • Precision Reference 2ppm/°C  typical

  • Outputs Drive ±10mA

Key Software Features

  • Independently Programmable Output Ranges:
    0V to 5V, 0V to 10V, ±2.5V, ±5V, ±10V

  • Support Windows or Linux OS

  • API

  • GET Console

     


Product Specifications

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Block Diagram

Form Factor/Physical
Size: ~ 21 x 64 mm
Weight: 0.014 lbs.

Electrical
Configuration: 16 Channels, Single Ended
Resolution: 16 Bits
Input Range:
0 V to +5 V
0 V to +10 V
+/- 2.5 V
+/- 5 V
+/- 10 V
Settling time: 9-20 ms
Throughput Rate: 4 μs / 16 channels

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Ordering Information

Power: TBD

Interface
PCI Express Version 2.1

Environmental
Operating Temperature   -40° to 85° C         
Storage Temperature       -55° to 125° C
Humidity        Design to Meet MIL STD 810G
Shock     Design to Meet MIL STD 810G
Vibration       Design to Meet MIL STD 810G

MTBF     TBD

Information on this data sheet is subject to change without notice. 



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