For more than three decades GET Engineering has provided ruggedized products and solutions to the DoD and their prime contractors. Our continued commitment to providing our customers with Lifetime Software and Hardware Support, Custom Solutions that are reliable and cost-effective has made us the leader in our industry. To facilitate this, GET Engineering provides a complete in-house engineering and manufacturing team enabling custom rapid solutions.
Continuing in this tradition, GET Engineering is please to introduce a High Density Input Output (HDIO) System. A 6U VME Carrier Card capable of interfacing 12 different HDIO Modules. With the various HDIO Modules available, the 6U VME Carrier Card is capable of up to 192 Digital Input/ Output bits, 192 ADC/DAC channels, 240 temperature channels, or 48 Serial channels.
Designed for reliability in a rugged and harsh environments, the HDIO System uses screws to reliably connect the HDIO module to the conduction cooled HDIO carrier card and thermal bars to conduct heat from the HDIO modules to the HDIO carrier card. The HDIO XMC Carrier Card can be conformally coated with Acrylic, Polyurethane or Parylene for increased reliability against environment.
Key Hardware Features
Military and Industrial Grade
6U VME Carrier Card
12 RIO Module Slots
Mix and Match Up To
192 DI or DO Bits,
192 AD or DA Channels
240 Temperature Channels, or
48 Serial Channels
PCI Express version 2.1 compliant
Key Software Features
Support Windows, Linux OS or VxWorks
Size: 6U 160 x 233 mm
12 RIO modules slots
Ethernet 10/100/1000 Port
VME 8-, 16– or 32-bit VME data transfer Slave only
Operating Temperature -40° to 85° C
Storage Temperature -55° to 125° C
Humidity Design to Meet MIL STD 810G
Shock Design to Meet MIL STD 810G
Vibration Design to Meet MIL STD 810G
Information on this data sheet is subject to change without notice.