GET Enginneering
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Product 10075101

Conduction Cooled PMC NTDS Serial


Product Overview

GET Engineering is proud to present its MIL‑STD‑1397 Serial Interface Adapter fully compliant to the ANSI/VITA‑20‑2001 Conduction Cooled PMC Standard. This adapter provides an ultra‑reliable MIL‑STD‑1397 Revision C Interface. All configuration parameters are accessible through a simple software user interface with FPGA‑controlled DMA channels for transmit and receive buffers to reduce host CPU overhead.

GET Engineering’s NTDS Serial card is available in either commercial or extended temperature range with an option for either Commercial Front Panel BJ‑77, BJ‑157 (50 Ohm) or BNC (75 Ohm) or Rear (P4) I/O. This card is supplied with a full featured driver API which is operating system independent enabling easy migration from one OS to another, for example Windows 7 to Linux.


Key Features

  • Common API across multiple operating systems

  • Memory Mapped Address Space

  • Independent FPGA‑controlled DMA Channels

  • Extensive Built‑in‑Test capabilities enable rapid troubleshooting of interface

  • Sample code provided for rapid Application Code Development

  • Time Stamping on data transactions

Key Hardware Features

  • ANSI/VITA 20‑2001 compliant PMC Module

  • Full‑Duplex 16 or 32‑bit transfers

  • User controlled Front Panel LED for Adapter Status

  • Command and Inter‑word time‑outs

  • Front or Rear Panel (P4) I/O configurations available


NTDS Parallel Interface MILSTD‑1397C Type D/E
Bus Interface IEEE 1386.1‑2002 Standard for common mezzanine card family
Form Factor ANSI/Vita 20‑2001 Standard Single CCPMC Card Module (74 mm x 143.77 mm)
Power Requirements +5VDC @ 1.4Amp
MTBF Greater than 200K hours MTBF per MIL‑HDBK‑217, Revision E, 25°C Ground Benign Environment
NTDS I/O Connectors Type E BJ77 or BJ157 Connector
Type D BNC Connector
Comercial Temperature 0°C to 55°C
Extended Temperature -40°C to 85°C

Configurations for this product


Environmental Specifications
Temperature Standard 0°C to 55°C Operating (MIL‑STD‑810, Method 501 and 502, Procedure II)
Extended Temperature Version -40°C to 85°C Operating (ANSI/VITA 47, Class CC4)
Storage Temperature -40°C to 85°C Operating (MIL‑STD‑810, Method 501 and 502 Procedure I)
Humidity 5% to 95% humidity operational (non‑condensing) (MIL‑STD‑810, Method 507)
Vibration 0.01g²/Hz 15–2KHz, Optional 0.1g²/Hz 15–2KHz (MIL‑STD‑810, Method 514, Procedure I)
Operating Shock 20 g peak, Optional 40 g peak (MIL‑STD‑810, Method 516, Procedure I)
Mean Time Between Failures Greater than 200K hours MTBF per MIL‑HDBK‑217, Revision E, 25°C Ground Benign Environment

Ordering Information

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